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AN824
Vishay Siliconix
PCB Design and Assembly Guidelines
For MICRO FOOT r Products
Johnson Zhao
INTRODUCTION
Vishay Siliconix’s MICRO FOOT product family is based on a
wafer-level chip-scale packaging (WL-CSP) technology that
implements a solder bump process to eliminate the need for an
outer package to encase the silicon die. MICRO FOOT
products include power MOSFETs, analog switches, and
power ICs.
For battery powered compact devices, this new packaging
technology reduces board space requirements, improves
thermal performance, and mitigates the parasitic effect typical
of leaded packaged products. For example, the 6 ? bump
MICRO FOOT Si8902EDB common drain power MOSFET,
which measures just 1.6 mm x 2.4 mm, achieves the same
performance as TSSOP ? 8 devices in a footprint that is 80%
smaller and with a 50% lower height profile (Figure 1). A
MICRO FOOT analog switch, the 6 ? bump DG3000DB, offers
low charge injection and 1.4 W on ? resistance in a footprint
measuring just 1.08 mm x 1.58 mm (Figure 2).
Vishay Siliconix MICRO FOOT products can be handled with
the same process techniques used for high-volume assembly
of packaged surface-mount devices. With proper attention to
PCB and stencil design, the device will achieve reliable
performance without underfill. The advantage of the device’s
small footprint and short thermal path make it an ideal option
for space-constrained applications in portable devices such as
battery packs, PDAs, cellular phones, and notebook
computers.
FIGURE 1. 3D View of MICRO FOOT Products Si8902DB and
Si8900EDB
3 2 1
0.18 ~ 0.25
A
0.5 1.08
This application note discusses the mechanical design and
reliability of MICRO FOOT, and then provides guidelines for
board layout, the assembly process, and the PCB rework
process.
0.285
0.285
0.5
1.58
B
FIGURE 2. Outline of MICRO FOOT CSP & Analog
Switch DG3000DB
Document Number: 71990
06-Jan-03
www.vishay.com
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